The Business Research Company has updated its global market reports with latest data for 2024 and projections up to 2033.
The 3D Semiconductor Packaging Global Market Report 2024 by The Business Research Company provides market overview across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, the Middle East, and Africa, encompassing 27 major global industries. The report presents a comprehensive analysis over a ten-year historic period (2010-2021) and extends its insights into a ten-year forecast period (2023-2033).
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According to The Business Research Company’s 3D Semiconductor Packaging Global Market Report 2024, The 3d semiconductor packaging market size has grown rapidly in recent years. It will grow from $13.66 billion in 2023 to $16.01 billion in 2024 at a compound annual growth rate (CAGR) of 17.2%. The growth in the historic period can be attributed to miniaturization and performance demands, advancements in semiconductor, rise in demand for high-performance computing, mobile and consumer electronics growth, iot and wearable devices.The 3d semiconductor packaging market size is expected to see rapid growth in the next few years. It will grow to $29.17 billion in 2028 at a compound annual growth rate (CAGR) of 16.2%.
Expanding the functionality and application scope of semiconductor or IC packages is anticipated to drive the growth of the 3D semiconductor packaging market in the future. Semiconductors, solid substances with conductivities between insulators and conductors, utilize IC packaging as a common method to enhance integration density and performance within a single package. For example, as reported in December 2021 by the Semiconductor Industry Association, a US-based trade association representing the semiconductor industry, global semiconductor sales reached $48.8 billion in October 2021, reflecting a 2.4% increase from the $39.4 billion recorded in October 2020. Furthermore, sales are projected to experience a 26% increase in 2021, surpassing $600 billion in 2022. Hence, the augmentation of functionality and application possibilities for semiconductor or IC packages is steering the growth of the 3D semiconductor packaging market
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The 3d semiconductor packaging market covered in this report is segmented –
1) By Type: 3D Through Silicon Via, 3D Package On Package, 3D Fan Out Based, 3D Wire Bonded
2) By Material: Organic Substrate, Bonding Wire, Leadframe, Encapsulation, Resins, Ceramic Packages, Die Attach Material, Other Materials
3) By Industry: Electronics, Industrial, Automotive and Transport, Healthcare, IT andTelecommunication or Aerospace and Defense
Top Major Players
Amkor Technology Inc.,
Austriamicrosystems AG,
Advanced Semiconductor Engineering Inc.,
International Business Machines Corporation,
Jiangsu Changjiang Electronics Technology Co. Ltd.
The 3d semiconductor packaging market report table of contents includes:
1. Executive Summary
- 3D Semiconductor Packaging Market Characteristics
- 3D Semiconductor Packaging Market Trends And Strategies
- 3D Semiconductor Packaging Market – Macro Economic Scenario
- Global 3D Semiconductor Packaging Market Size and Growth
- 3D Semiconductor Packaging Market Segmentation
- 3D Semiconductor Packaging Market Regional And Country Analysis
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- Key Mergers And Acquisitions In The 3D Semiconductor Packaging Market
- 3D Semiconductor Packaging Market Future Outlook and Potential Analysis
- Appendix
List Of Tables :
Table 1: Global Historic Market Growth, 2018-2023, $ Billion
Table 2: Global Forecast Market Growth, 2023-2028F, 2033F, $ Billion
Table 3: Global 3D Semiconductor Packaging Market, Segmentation By Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
Table 4: Global 3D Semiconductor Packaging Market, Segmentation By Material, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
Table 5: Global 3D Semiconductor Packaging Market, Segmentation By Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
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Table 74: Amkor Technology Inc. Financial Performance
Table 75: austriamicrosystems AG Financial Performance
Table 76: Advanced Semiconductor Engineering Inc. Financial Performance
Table 77: International Business Machines Corporation Financial Performance
Table 78: Jiangsu Changjiang Electronics Technology Co. Ltd. Financial Performance
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