Rising demand for miniaturization of electronic devices is a major factor attributable to the growth of the market.
According to TechSci Research report, “Global 3D TSV Devices Market – Industry Size, Share, Trends, Competition Forecast & Opportunities, 2028”. The Global 3D TSV Devices is anticipated to project robust growth in the forecast period with a CAGR of 5.93% through 2028, Rising demand for miniaturization of electronic devices drives the growth of the 3D TSV market. These products may be achieved by hetero system integration, which may give more reliable advanced packaging. With extremely small MEMS sensors and 3D packaged electronics, one can place sensors virtually anywhere and could monitor equipment in harsh environments, in real-time, to help increase reliability and uptime.
3D TSV in dynamic random-access memory (DRAM) that stores each bit of data in a separate tiny capacitor within an integrated circuit propels the growth of the 3D TSV market. Micron’s 3D DRAM with re-architected DRAM achieves significant improvements in power and timing, which help in developing advanced thermal modeling.
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Based on Product, LED packaging segment is expected to dominate the market during the forecast period. The increasing use of light-emitting diodes (LED) in products has promoted the development of higher power, greater density, and lower-cost devices. The use of three-dimensional (3D) packaging through-silicon via (TSV) technology allows a high density of vertical interconnects, unlike 2D packaging. TSV integrated circuit reduced connection lengths, and thus, smaller parasitic capacitance, inductance, and resistance are required where a combination of monolithic and multifunctional integration is done efficiently, which provides high-speed low-power interconnects.
The embedded design with thin silicon membranes at the bottom optimizes the thermal contact and therefore minimizes the thermal resistance. Through silicon via (TSV) provides the electrical contact to the surface-mounted devices and mirrored sidewalls increase the package reflectivity and improve the light efficiency. The SUSS AltaSpray technology is capable of coating integration of 90° corners, KOH (Potassium Hydroxide) etched cavities, Through Silicon Via (TSV) ranging from a few microns to 600μm or more. The ability to produce conformal resist coatings on severe topography, such as TSV, makes them the ideal choice for wafer-level packaging in LED, which increases the market growth.
Based on Region, Asia Pacific is Expected to dominate the market. Asia-Pacific is the fastest-growing market as countries in the region, such as China, Japan, South Korea, Indonesia, Singapore, and Australia, have recorded high levels of manufacturing in the consumer electronics, automotive, and transportation sectors, which a key source of demand for 3D TSV market. Asia-Pacific is also one of the most active manufacturing hubs in the world. The rising popularity of smartphones and demand for new memory technologies have increased the growth of computationally intensive consumer electronics, thereby, creating a wide range of opportunities in this region. As silicon wafers are widely used to manufacture smartphones, the introduction of 5G technology is expected to boost the sales of 5G smartphones, which may grow the market in the telecommunication sector.
In April 2019, in Korea, a collective laser‐assisted bonding process for 3D TSV integration with NCP( nonconductive paste) is made, where several TSV dies can be stacked simultaneously to improve the productivity while maintaining the reliability of the solder joints through Laser‐assisted bonding (LAB) advanced technology. These solder joints may increase the growth in consumer and commercial segments, which may increase the growth of the market.
Key market players in the Global 3D TSV Devices Market are following:-
- Taiwan Semiconductor Manufacturing Company Limited (TSMC)
- Samsung Group
- Toshiba Corporation
- Pure Storage Inc.
- ASE Group
- Amkor Technology
- United Microelectronics Corp.
- STMicroelectronics NV
- Broadcom Ltd
- Intel Corporation
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“The global 3D TSV (Through-Silicon Via) devices market is driven by several key factors. First, there is a constant demand for smaller and more powerful electronic devices, such as smartphones, wearables, and IoT devices. 3D TSV technology allows for the vertical stacking of multiple chips, enabling miniaturization without compromising performance. Second, the growth of high-performance computing (HPC) and artificial intelligence (AI) applications necessitates advanced semiconductor solutions. 3D TSV devices facilitate the integration of specialized chips like GPUs and memory, boosting computing power for AI training and data-intensive tasks. Third, the expansion of memory solutions is critical in data centers, cloud computing, and consumer electronics. 3D TSV technology increases memory density and bandwidth, meeting the demand for high-capacity memory. Fourth, emerging technologies like 5G and 6G require 3D TSV devices to support high-speed data transfer and low latency in communication systems. Lastly, energy efficiency is a pressing concern, and 3D TSV devices reduce power consumption by minimizing interconnect distances. These drivers collectively fuel the growth of the 3D TSV devices market across various industries.” said Mr. Karan Chechi, Research Director with TechSci Research, a research-based global management consulting firm.
3D TSV Devices Market – Global Industry Size, Share, Trends, Opportunity, and Forecast Segmented by Product (Memory, MEMS, CMOS Image Sensors, Imaging and Opto Electronics, and Advanced LED packaging), Application (Consumer Electronics Sector, Information and Communication Technology Sector, Automotive Sector, Military, Aerospace, and Defence Sector), By Region, Competition 2018-2028 has evaluated the future growth potential of Global 3D TSV Devices Market and provides statistics and information on market structure, size, share, and future growth. The report is intended to provide cutting-edge market intelligence and help decision makers take sound investment decisions. Besides, the report also identifies and analyzes the emerging trends along with essential drivers, challenges, and opportunities present in the Global 3D TSV Devices Market.
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