Semiconductor Assembly And Packaging Equipment Global Market Report 2021 by The Business Research Company is the most comprehensive report available on this market and will help gain a truly global perspective as it covers 60 geographies. The chapter on the impact – both negative and positive – of COVID-19 on the semiconductor assembly and packaging equipment industry gives valuable insights on supply chain disruptions, logistical challenges, and other economic implications of the virus on the market. This includes revised market numbers according to the effects of the coronavirus and the expected semiconductor assembly and packaging equipment market growth numbers 2021-2030.
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The Semiconductor Assembly And Packaging Equipment Global Market Report 2020-30 by The Business Research Company provides an in-depth analysis of the global semiconductor assembly and packaging equipment market and covers both the historic period, 2015 to 2020, and the forecast period, 2020 to 2030. The report evaluates the market and major economies across the regions Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
The Semiconductor Assembly And Packaging Equipment Global Market Report 2021 covers semiconductor assembly and packaging equipment market drivers, semiconductor assembly and packaging equipment market trends, semiconductor assembly and packaging equipment market growth rate, semiconductor assembly and packaging equipment market major players, player-adopted strategies in the market, and semiconductor assembly and packaging equipment market size.
The global semiconductor assembly and packaging equipment market is expected to grow from $11.92 billion in 2020 to $13.44 billion in 2021 at a compound annual growth rate (CAGR) of 12.8%. The growth is mainly due to the companies rearranging their operations and recovering from the COVID-19 impact, which had earlier led to restrictive containment measures involving social distancing, remote working, and the closure of commercial activities that resulted in operational challenges. The market is expected to reach $21.39 billion in 2025 at a CAGR of 12.3%.
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The report covers the semiconductor assembly and packaging equipment market segments-
1) By Type: Plating Equipment, Inspection And Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment
2) By Application: Consumer Electronics, Healthcare Devices, Automotive, Enterprise Storage, Others
3) By End-User: OSATs, IDMs
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