The Advanced Packaging Technologies Global Market Report 2023 by The Business Research Company, provides advanced packaging technologies market overview across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa for the 27 major global industries. The report covers a ten-year historic period – 2010-2021, and a ten-year forecast period – 2023-2032.
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According to The Business Research Company’s Advanced Packaging Technologies Global Market Report 2023, the market size is expected to grow from the global advanced packaging technologies market size grew from $5.74 billion in 2022 to $6.52 billion in 2023 at a compound annual growth rate (CAGR) of 13.6%. The market size advanced packaging technologies is expected to grow to $10.44 billion in 2027 at a CAGR of 12.5%.
Growing demand for consumer electronics is expected to propel the growth of the advanced packaging market going forward. Consumer electronics refers to any electronic equipment, gadgets, or devices made to be purchased and used on a regular basis for non-commercial or professional purposes by consumers. Consumer electronics can create demand for advanced packaging as it plays an important role in defining the sophistication of the products.
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The advanced packaging technologies market is segmented:
1) By Type: 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Other Types
2) By Product: Active Packaging, Smart And Intelligent Packaging
3) By End Use Industry: Automotive And Transport, Consumer Electronics, Industrial, IT And Telecommunication, Other End Use Industries
The advanced packaging technologies market consists of revenues earned by entities by providing packaging services such as fan-out wafer-level packaging and system-in-package used during the process. The market value includes the value of related goods sold by the service provider or included within the service offering. The advanced packaging technologies market also includes sales of image sensor, microelectronics, complementary metal oxide semiconductor, light-emitting diode, design package, external cavity, ultraviolet light, and others which are used in providing packaging services. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The advanced packaging technologies market report table of contents includes:
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