Advanced Packaging Technologies Market Growth Trajectory Through 2024-2033

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The Advanced Packaging Technologies Global Market Report 2024 by The Business Research Company provides market overview across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, the Middle East, and Africa, encompassing 27 major global industries. The report presents a comprehensive analysis over a ten-year historic period (2010-2021) and extends its insights into a ten-year forecast period (2023-2033).

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According to The Business Research Company’s Advanced Packaging Technologies Global Market Report 2024, The advanced packaging technologies market size has grown rapidly in recent years. It will grow from $6.46 billion in 2023 to $7.3 billion in 2024 at a compound annual growth rate (CAGR) of 12.9%. The growth in the historic period can be attributed to consumer electronics growth, mobile computing, enhanced thermal management, automotive electronics, environmental considerations.

The advanced packaging technologies market size is expected to see rapid growth in the next few years. It will grow to $12.33 billion in 2028 at a compound annual growth rate (CAGR) of 14.0%. The growth in the forecast period can be attributed to heterogeneous integration, quantum computing, flexible and stretchable electronics, supply chain resilience, smart manufacturing. Major trends in the forecast period include advanced interconnect technologies, fan-out wafer-level packaging, system-in-package, thermal management solutions, embedded packaging for IoT devices.

Growing demand for consumer electronics is expected to propel the growth of the advanced packaging market going forward. Consumer electronics refers to any electronic equipment, gadgets, or devices made to be purchased and used on a regular basis for non-commercial or professional purposes by consumers. Consumer electronics can create demand for advanced packaging as it plays an important role in defining the sophistication of the products. For instance, in June 2021, Oberlo, a Lithuania-based e-commerce platform, said that globally, 6.4 billion people use smartphones. Therefore, the growing demand for consumer electronics is driving the growth of the advanced packaging market.

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The advanced packaging technologies market covered in this report is segmented –

1) By Type: 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Other Types

2) By Product: Active Packaging, Smart And Intelligent Packaging

3) By End Use Industry: Automotive And Transport, Consumer Electronics, Industrial, IT And Telecommunication, Other End Use Industries

Major companies operating in the advanced packaging technologies market are increasing their focus on introducing high-performance glass substrates to gain a competitive edge in the market. Glass substrates are flat, rigid sheets or panels made of glass that serve as a base or foundation for various electronic devices, displays, sensors, or other technologies that require a smooth and transparent surface. For instance, in June 2023, Intel Corporation, a US-based technology company, unveiled glass substrates for advanced packaging that are expected to offer several advantages for the company. These glass substrates can tolerate higher temperatures, offer 50% less pattern distortion, and have ultra-low flatness for improved depth of focus. Compared to organic substrates, glass offers improved properties such as ultra-low flatness and better thermal and mechanical properties, resulting in much higher interconnect density in a substrate.

The advanced packaging technologies market report table of contents includes: