Advanced Packaging Technologies Market: Opportunities, Strategies, Size, Share, and Analysis 2024-2033

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Overview and Scope

Advanced packaging technologies refer to the technologies involved in the aggregation and interconnection of components before traditional electronic packaging. It allows integrated circuits to be enclosed in a casing, which prevents metallic parts from corroding and physical damage.

Sizing and Forecast

The advanced packaging technologies market size has grown rapidly in recent years. It will grow from $6.46 billion in 2023 to $7.3 billion in 2024 at a compound annual growth rate (CAGR) of 12.9%. The growth in the historic period can be attributed to consumer electronics growth, mobile computing, enhanced thermal management, automotive electronics, environmental considerations.

The advanced packaging technologies market size is expected to see rapid growth in the next few years. It will grow to $12.33 billion in 2028 at a compound annual growth rate (CAGR) of 14.0%. The growth in the forecast period can be attributed to heterogeneous integration, quantum computing, flexible and stretchable electronics, supply chain resilience, smart manufacturing. Major trends in the forecast period include advanced interconnect technologies, fan-out wafer-level packaging, system-in-package, thermal management solutions, embedded packaging for IoT devices.

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Segmentation & Regional Insights

The advanced packaging technologies market covered in this report is segmented –

1) By Type: 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Other Types

2) By Product: Active Packaging, Smart And Intelligent Packaging

3) By End Use Industry: Automotive And Transport, Consumer Electronics, Industrial, IT And Telecommunication, Other End Use Industries

Asia-Pacific was the largest region in global advanced packaging technologies market in 2023. The regions covered in the advanced packaging technologies market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

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Major Driver Impacting Market Growth

Growing demand for consumer electronics is expected to propel the growth of the advanced packaging market going forward. Consumer electronics refers to any electronic equipment, gadgets, or devices made to be purchased and used on a regular basis for non-commercial or professional purposes by consumers. Consumer electronics can create demand for advanced packaging as it plays an important role in defining the sophistication of the products. For instance, in June 2021, Oberlo, a Lithuania-based e-commerce platform, said that globally, 6.4 billion people use smartphones. Therefore, the growing demand for consumer electronics is driving the growth of the advanced packaging market.

Key Industry Players

Major companies operating in the advanced packaging technologies market report are Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, International Business Machines, Qualcomm Technologies, Advanced Semiconductor Engineering (ASE), ASE Technology Holding Co. Ltd., Texas Instruments, Shin-Etsu Chemical Co. Ltd., Renesas Electronics Corporation, GlobalFoundries Inc., Sanmina Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology, STATS ChipPAC, Tongfu Microelectronics, Powertech Technology, ChipMOS Technologies Inc., United Test and Assembly Center Holdings Ltd., Unisem (M) Berhad., Greatek Electronics, Nepes Corporation, SFA Semicon, SÜSS Microtec, China WLCSP Co. LTD., Universal Instruments Corporation, Brewer Science, Chipbond Technology Corporation, Deca Technologies, Siliconware Precision Industries, Silicon Mobility SAS., Lam Research Corporation, Toshiba Electronic Devices & Storage Corporation, King Yuan Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Chip One Stop Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Hana Micron Inc., IBIDEN Engineering CO. LTD., Aehr Test Systems

The advanced packaging technologies market report table of contents includes: