The Business Research Company’s Fan-Out Wafer Level Packaging Global Market Report 2024 is the most detailed report available on the market, including broad forecast periods and multiple geographies. The report covers the historic period – 2010-2021, and the forecast period – 2023-2032. The Fan-Out Wafer Level Packaging Global Market Report 2023 evaluates fan-out wafer level packaging market size, growth rate, drivers, trends, and major companies.
The report provides a global perspective by covering 60 geographies and focusing on major economies in each region – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
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The global fan-out wafer level packaging market is expected to grow from $2.13 billion in 2023 to $2.43 billion in 2024 at a compound annual growth rate (CAGR) of 14.1%. The growth in the historic period can be attributed to miniaturization of electronics, increased integration, improved electrical performance, global expansion. The fan-out wafer level packaging market size is expected to see rapid growth in the next few years. It will grow to $3.94 billion in 2028 at a compound annual growth rate (CAGR) of 12.8%.
5G technology adoption in emerging countries is expected to propel the growth of the fan-out wafer-level packaging market in the coming future. 5G is the fifth generation of cellular network technology designed to increase speed, reduce latency and improve the flexibility of wireless services. Fan-out wafer-level packaging helps 5G technology by providing shorter interconnects and reduced inductance, enhancing RF and millimeter-wave performance. For instance, in April 2023, according to 5G Americas, a US-based trade association representing major telecom companies, between the end of 2021 and the end of 2022, global 5G wireless internet connections ascended by 76%, reaching 1.05 billion. Further, North America leads the way in wireless 5G connection adoption, reaching 507 million Volte and 119 million 5G connections expected by the end of the fourth quarter of 2022. Therefore, 5G technology adoption in emerging countries is driving the fan-out wafer-level packaging market.
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The fan-out wafer level packaging market segments in the report are:
1) By Process Type: Standard-Density Packaging, High-Density Packaging, Bumping
2) By Business Model: Outsourced Semiconductor Assembly and Test (OSAT), Foundry, Integrated Device Manufacturer (IDM)
3) By Application: Consumer Electronics, Industrial, Automotive, Healthcare, Aerospace And Defense, IT And Telecommunication, Other Applications
The table of contents in TBRC’s fan-out wafer level packaging market report includes:
- Executive Summary
- Fan-Out Wafer Level Packaging Market Characteristics
- Fan-Out Wafer Level Packaging Market Trends And Strategies
- Fan-Out Wafer Level Packaging Market – Macro Economic Scenario
- Global Fan-Out Wafer Level Packaging Market Size and Growth
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- Global Fan-Out Wafer Level Packaging Market Competitive Benchmarking
- Global Fan-Out Wafer Level Packaging Market Competitive Dashboard
- Key Mergers And Acquisitions In The Fan-Out Wafer Level Packaging Market
- Fan-Out Wafer Level Packaging Market Future Outlook and Potential Analysis
- Appendix
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