The Semiconductor Assembly And Packaging Equipment Global Market Report 2023 by The Business Research Company, provides semiconductor assembly and packaging equipment market overview across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa for the 27 major global industries. The report covers a ten-year historic period – 2010-2021, and a ten-year forecast period – 2023-2032.
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According to The Business Research Company’s Semiconductor Assembly And Packaging Equipment Global Market Report 2023, the market size will grow from $10.44 billion in 2022 to $11.82 billion in 2023 at a compound annual growth rate (CAGR) of 13.3%. The Russia-Ukraine war disrupted the chances of global economic recovery from the COVID-19 pandemic, at least in the short term. The war between these two countries has led to economic sanctions on multiple countries, a surge in commodity prices, and supply chain disruptions, causing inflation across goods and services and affecting many markets across the globe. The market size of the global semiconductor assembly and packaging equipment is expected to grow to $18.72 billion in 2027 at a CAGR of 12.2%.
Rising demand for consumer electronics is anticipated to contribute to the growth of the semiconductor assembly and packaging equipment market. Consumer electronics is a key segment that is entirely dependent on the semiconductor industry.
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The semiconductor assembly and packaging equipment market is segmented:
1) By Type: Plating Equipment, Inspection and Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment
2) By Application: Consumer Electronics, Healthcare Devices, Automotive, Enterprise Storage, Other Applications
3) By End-User: OSATs, IDMs
Technological advancements are a key trend gaining popularity in the semiconductor assembly and packaging equipment market. Major companies operating in the market are focused on introducing new technologies such as compound equipment for better packaging applications. For example, in January 2022, Shengmei Semiconductor equipment (Shanghai) Co., Ltd., a China-based provider of wafer process solutions for semiconductor foreground and advanced wafer-level packaging (WLP) applications, launched a series of integrated equipment to support compound semiconductor manufacturing. The compound semiconductor wet process product line includes gluing equipment, development equipment, photoresist de-gluing equipment, wet etching equipment, cleaning equipment and metal plating equipment, and is automatically compatible with flat edges or notched wafers.
The semiconductor assembly and packaging equipment market report table of contents includes:
1. Executive Summary
2. Semiconductor Assembly And Packaging Equipment Market Characteristics
3. Semiconductor Assembly And Packaging Equipment Market Trends And Strategies
4. Semiconductor Assembly And Packaging Equipment Market – Macro Economic Scenario
5. Semiconductor Assembly And Packaging Equipment Market Size And Growth
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26. Africa Semiconductor Assembly And Packaging Equipment Market
27. Semiconductor Assembly And Packaging Equipment Market Competitive Landscape And Company Profiles
28. Key Mergers And Acquisitions In The Semiconductor Assembly And Packaging Equipment Market
29. Semiconductor Assembly And Packaging Equipment Market Future Outlook and Potential Analysis
30. Appendix
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