The Business Research Company’s Semiconductor Assembly And Packaging Equipment Global Market Report 2023 is the most detailed report available on the market, including broad forecast periods and multiple geographies. The report covers the historic period – 2010-2021, and the forecast period – 2023-2032. The Semiconductor Assembly And Packaging Equipment Global Market Report 2023 evaluates semiconductor assembly and packaging equipment market size, growth rate, drivers, trends, and major companies.
The report provides a global perspective by covering 60 geographies and focusing on major economies in each region – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
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The global semiconductor assembly and packaging equipment market is expected to grow from $18,508.8 million in 2027 at a rate of 12.2%. The market is then expected to grow at a CAGR of 12.1% from 2027 and reach $32,709.2 million in 2032.
The rise in demand for electric vehicles (EVs) across the world will contribute to the growth of the semiconductor assembly and packaging equipment market in the forecast period. Semiconductors are the most important part of electric vehicles. The aggregate value of semiconductors used in an electric vehicle is more than twice that of an internal combustion engine. Semiconductors make it possible for electric cars to be efficient, interactive and safe. Thus, an increase in demand for EVs will increase the demand for semiconductors. For example, the National Institution for Transforming India (NITI) Aayog, India based state-of-the-art resource center, projected EVs to supply 30% of new private car sales in India, 70% of commercial cars, 40% of buses and 80% of two and three-wheelers by 2030, driven by Faster Adoption and Manufacturing of Hybrid and Electric Vehicles (FAME II), and other measures. This amounts to having 80 million electric vehicles on the road by 2030. Furthermore, in September 2022, according to the International Energy Agency, a Paris-based autonomous intergovernmental organization, electric vehicle (EV) sales doubled from the previous year in 2021, reaching a new high of 6.6-million-unit sales. Additionally, the sales of electric cars worldwide in 2021 had a sales share of 4%. Therefore, the rise in demand for EVs will increase the demand for semiconductors, thereby contributing to the growth of the semiconductor assembly and packaging equipment market in the forecast period.
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The semiconductor assembly and packaging equipment market segments in the report are:
1) By Type: Plating Equipment, Inspection And Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment, Other Types
2) By Application: Consumer Electronics, Healthcare Devices, Automotive, Enterprise Storage, Other Applications
3) By End-User: OSATs, IDMs
The table of contents in TBRC’s semiconductor assembly and packaging equipment market report includes:
- Executive Summary
- Table Of Contents
- List Of Figures
- List Of Tables
- Report Structure
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- Competitive Landscape And Company Profiles
- Key Mergers and Acquisitions
- Opportunities And Strategies
- Semiconductor Assembly And Packaging Equipment Market, Conclusions And Recommendations
- Appendix
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