The global non-UV dicing tapes market is presently valued at USD 1.59 billion and is poised to reach a valuation of USD 2.13 billion by 2030, registering a CAGR of 6% over the forecast period of 2022-2030.
What are the primary growth determinants and restraints to the industry vertical?
The ability of these tapes to assist the production of energy efficient electronic devices at an affordable cost is primarily augmenting the outlook of this business vertical. Alongside, the booming consumer electronics energy is adding momentum to the market expansion.
Furthermore, the increasing trends of electronic component miniaturization to decrease the weight of electronic devices for ease of transportation and portability is creating lucrative opportunities for the industry to prosper.
Also, integration of advanced technologies in the field, rapid industrialization, and growing disposable income levels of the masses are positively swaying the dynamics of this business sphere. Besides, rising internet penetration across the globe is escalating the demand for smart devices and wearables. This in turn is fueling the expansion of global non-UV dicing tapes market.
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Moreover, the growing focus of manufacturers to develop advanced products in the field is stimulating the outlook of the industry vertical. Alongside, increasing cognizance regarding the benefits of non-UV dicing tapes among the end-users is contributing to the market growth.
On the contrary, the volatility in raw material prices and lack of favorable government incentives in various nations are limiting the remuneration scope of this industry vertical.
Segmental analysis of the market
Based on material type, the business sphere is split into PVC, PET, PO, and Others. The PO segment is slated to amass notable gains by 2030 owing to their high durability along with pressure and temperature resistance.
By thickness, the industry is fragmented into 85-125 Micron, 126-150 Micron, Below 85 Micron, and Above 150 Micron.
In terms product, the market is classified into UV curable dicing type and non-UV curable dicing type. The UV curable dicing type segment is expected to generate significant returns over the assessment timeframe as it offers high security to wafers while dicing.
On the basis of application, the global non-UV dicing tapes market is divided into wafer dicing, package dicing, and others. The wafer dicing segment is likely to showcase lucrative growth trends over the forecast period ascribing to the increasing demand for durable consumer electronics.
Expounding the geographical ambit of this business sphere
North America, Middle East & Africa, Europe, Asia Pacific, and Latin America are the major benefactors to the expansion of this market vertical. Among these, Asia Pacific is projected to capture a substantial revenue share over 2022-2030. This is attributable to the booming consumer electronics industry, availability of raw materials and low cost labor force, technological advancements in the field, along with widespread industrialization.
Insights to the competitive hierarchy of the market
The prominent players defining the competitive terrain of the global non-UV dicing tapes market are Nitto Denko Corp, Mitsui Chemicals Inc., Sumitomo Bakelite Co. Ltd., AI Technology, Inc., LINTEC Corporation, Denka Company Limited, Ultron Systems, Inc., Pantech Tape Co. Ltd., QES GROUP BERHAD, Nippon Pulse Motor Taiwan, Loadpoint Limited., Daest Coating India Pvt. Ltd., Shenzhen Xinst Technology Co. Ltd., and Solar Plus Company.
The aforementioned companies are continuously focusing onto amplifying their reach in the global market by formulating efficient strategies including mergers & acquisitions, new product launches, R&D investments, collaboration deals, and partnerships.
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