The polyamide hot melt adhesives market size is expected to see strong growth in the next few years. It will grow to $0.8 billion in 2028 at a compound annual growth rate (CAGR) of 6.2%. The growth in the forecast period can be attributed to growth of the packaging industry, increased focus on lightweight aerospace materials, increased demand for electric vehicles, growing demand in electronics. Major trends in the forecast period include advancements in manufacturing technologies, advancements in 5G and electronics, advances in packaging, advancements, integration with circular economy initiatives, application-specialized innovation.
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Scope Of Polyamide Hot Melt Adhesives Market
The Business Research Company’s reports encompass a wide range of information, including:
1. Market Size (Historic and Forecast): Analysis of the market’s historical performance and projections for future growth.
2. Drivers: Examination of the key factors propelling market growth.
3. Trends: Identification of emerging trends and patterns shaping the market landscape.
4. Key Segments: Breakdown of the market into its primary segments and their respective performance.
5. Focus Regions and Geographies: Insight into the most critical regions and geographical areas influencing the market.
6. Macro Economic Factors: Assessment of broader economic elements impacting the market.
Polyamide Hot Melt Adhesives Market Overview
Market Drivers –
The increasing demand for consumer electronics is expected to propel the growth of the polyamide hot melt adhesives market going forward. Consumer electronics refer to electronic devices intended for everyday use by individuals. Consumer electronics use showcases an advancement towards new technology, increasing internet penetration, the proliferation of smart devices, and enhanced connectivity that cater to diverse consumer needs and preferences. Polyamide hot melt adhesives provide high thermal stability, excellent electrical insulation, and solid and durable bonds that withstand mechanical stress and temperature fluctuations, ensuring reliable and long-lasting component assemblies. For instance, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, the total electronic equipment production in Japan reached 771,457 units. In addition, consumer electronics production reached 32,099 units in May 2023, compared to 25,268 units in May 2022. Therefore, the increasing demand for consumer electronics is driving the growth of the polyamide hot melt adhesives market.
Market Trends –
Major companies operating in the polyamide hot melt adhesives market are developing hot melt label adhesive solutions to improve durability, performance, and versatility for a wide range of labeling applications. A hot melt label adhesive solution is an adhesive used for applying labels activated by heat. For instance, in April 2023, Avery Dennison and Dow, a US-based company operating in materials science and digital identification solutions, launched a groundbreaking hot melt label adhesive aimed at enhancing the recyclability of packaging. This innovative adhesive allows for the mechanical recycling of polyolefin filmic labels and polypropylene (PP) or polyethylene (PE) packaging in a single stream, effectively treating them as a mono-material. It is the first olefinic hotmelt adhesive designed explicitly for chilled food applications on the label market. The adhesive has received approval from Recyclass for recycling in the high density polyethylene (HDPE) colored stream in European markets.
The polyamide hot melt adhesives market covered in this report is segmented –
1) By Type: Granules, Powder, Other Types
2) By Form: Thermosetting, Thermoplastic
3) By Application: Shoes And Textile, Automotive, Electrical, Woodworking, Other Applications
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Regional Insights –
Asia-Pacific was the largest region in the polyamide hot melt adhesives market in 2023, and is expected to be the fastest-growing region in the forecast period. The regions covered in the polyamide hot melt adhesives market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
Key Companies –
Major companies operating in the polyamide hot melt adhesives market are BASF SE, 3M Company, Henkel AG And Co. KGaA, Evonik Industries, Dow Chemical Company, Sika AG, Arkema S.A., Huntsman Corporation, H.B. Fuller Company, Bostik Inc., DuPont, TEX YEAR INDUSTRIES INC., Beardow Adams Ltd., Shanghai Tianyang Hot Melt Adhesive Co. Ltd., Jowat SE, Bühnen GmbH & Co. KG, Palmetto Adhesives Company, Schaetti, Sipol, Huate Bonding Material, Shanghai Tianyang, Bond Tech Industries
Table of Contents
1. Executive Summary
2. Polyamide Hot Melt Adhesives Market Report Structure
3. Polyamide Hot Melt Adhesives Market Trends And Strategies
4. Polyamide Hot Melt Adhesives Market – Macro Economic Scenario
5. Polyamide Hot Melt Adhesives Market Size And Growth
…..
27. Polyamide Hot Melt Adhesives Market Competitor Landscape And Company Profiles
28. Key Mergers And Acquisitions
29. Future Outlook and Potential Analysis
30. Appendix
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