Overview and Scope
Semiconductor assembly and testing services refer to assembling individual semiconductor components into complete integrated circuits (ICs) or chips and testing them for functionality, reliability, and quality assurance. These services are crucial in the semiconductor manufacturing supply chain, ensuring that semiconductor devices meet performance specifications and quality standards before being shipped to customers.
Sizing and Forecast
The semiconductor assembly and testing services market size has grown strongly in recent years. It will grow from $32.78 billion in 2023 to $34.94 billion in 2024 at a compound annual growth rate (CAGR) of 6.6%. The growth in the historic period can be attributed to the widespread adoption of smartphones and tablets, growth in consumer electronics, increasing globalization, need for innovative packaging solutions, increasing adoption of advanced packaging technologies.
The semiconductor assembly and testing services market size is expected to see strong growth in the next few years. It will grow to $45.67 billion in 2028 at a compound annual growth rate (CAGR) of 6.9%. The growth in the forecast period can be attributed to continuous innovation in semiconductor technologies, deployment of 5G networks, the proliferation of Internet of Things (IoT) devices, rise of electric vehicles, popularity of wearable devices. Major trends in the forecast period include the proliferation of the Internet of Things (IoT), the rollout of 5G networks, the automotive industry’s transition toward electric vehicles (EVs), continued expansion of cloud computing infrastructure, and increasing adoption of renewable energy technologies.
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Segmentation & Regional Insights
The semiconductor assembly and testing services market covered in this report is segmented –
1) By Service: Assembly And Packaging Services, Testing Services
2) By Packaging Technology: Flip-Chip, Wire Bond, Other Packaging Technologies
3) By End Use Industry: Telecommunication, Computing And Networking, Consumer Electronics, Industrial, Automotive Electronics, Other End-Use Industries
Asia-Pacific was the largest region in the semiconductor assembly and testing services market in 2023. The regions covered in the semiconductor assembly and testing services market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
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Major Driver Impacting Market Growth
The increasing demand for consumer electronics is expected to propel the growth of the semiconductor assembly and testing services market going forward. Consumer electronics refers to devices crafted explicitly for purchase and utilization by end-users or consumers for personal and non-commercial/professional uses in their daily lives. The demand for consumer electronics is rising due to rising disposable income levels, shifts in consumer lifestyles, rapid urbanization, and the proliferation of e-commerce platforms. The semiconductor assembly and testing services support the consumer electronics industry by providing high-quality, reliable, and cost-effective semiconductor components that power various devices, including smartphones, tablets, laptops, wearables, and smart home appliances. For instance, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, the total consumer electronics production increased from $161.17 million (Â¥25,268 million) in May 2022 to $204.75 million (Â¥32,099 million) in May 2023. Therefore, the increasing demand for consumer electronics is driving the growth of the semiconductor assembly and testing services market going forward.
Key Industry Players
Major companies operating in the semiconductor assembly and testing services market are Powertech Technology Inc., Taiwan Semiconductor Manufacturing Company, Intel Corporation, Micron Technology Inc., ASE Technology Group, QUALCOMM Inc., Amkor Technology Inc., Teledyne Technologies Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Siliconware Precision Industries Co. Ltd., Tianshui Huatian Technology Co. Ltd., Global Foundries Inc., Integrated Microelectronics Inc., King Yuan Electronics Corp., STATS chipPAC Ltd., ChipMOS Technologies INC., Chipbond Technology Corporation, UTAC Holdings Ltd., Unisem Group, Formosa Advanced Technologies Co. Ltd., Walton Advanced Engineering Inc., Lingsen Precision Industries Ltd., Integra Technologies LLC, Greatek Electronics Inc., CORWIL Technology Corp.
The semiconductor assembly and testing services market report table of contents includes:
1. Executive Summary
2. Semiconductor Assembly And Testing Services Market Characteristics
3. Semiconductor Assembly And Testing Services Market Trends And Strategies
4. Semiconductor Assembly And Testing Services Market – Macro Economic Scenario
5. Global Semiconductor Assembly And Testing Services Market Size and Growth
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31. Semiconductor Assembly And Testing Services Market Other Major And Innovative Companies
32. Global Semiconductor Assembly And Testing Services Market Competitive Benchmarking
33. Global Semiconductor Assembly And Testing Services Market Competitive Dashboard
34. Key Mergers And Acquisitions In The Semiconductor Assembly And Testing Services Market
35. Semiconductor Assembly And Testing Services Market Future Outlook and Potential Analysis
36.Appendix
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