The semiconductor capital equipment global market report 2024from The Business Research Company provides comprehensive market statistics, including global market size, regional shares, competitor market share, detailed segments, trends, and opportunities. This report offers an in-depth analysis of current and future industry scenarios, delivering a complete perspective for thriving in the industrial automation software market.
Semiconductor Capital Equipment Market, 2024The semiconductor capital equipment global market report 2024
Market Size –
The semiconductor capital equipment market size has grown strongly in recent years. It will grow from $76.39 billion in 2023 to $82.86 billion in 2024 at a compound annual growth rate (CAGR) of 8.5%. The growth in the historic period can be attributed to technological advancements in semiconductor devices, growth in consumer electronics demand, expansion of data centers and cloud infrastructure, rise in automotive electronics, advancements in AI and ML technologies, economic cycles affecting demand, innovations in memory and storage, and a focus on sustainable manufacturing.
The semiconductor capital equipment market size is expected to see strong growth in the next few years. It will grow to $115.27 billion in 2028 at a compound annual growth rate (CAGR) of 8.6%. The growth in the forecast period can be attributed to 5G technology adoption, expansion of IoT devices, shift towards advanced packaging, complexity in semiconductor designs, demand for high-performance computing, supply chain resilience and security, and green technology investments. Major trends in the forecast period include the integration of AI in manufacturing, the development of new semiconductor materials, a focus on wafer-level packaging, advanced metrology and inspection techniques, Industry 4.0 adoption in fabs, Growth of equipment leasing models.
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Scope Of Semiconductor Capital Equipment Market
The Business Research Company’s reports encompass a wide range of information, including:
1. Market Size (Historic and Forecast): Analysis of the market’s historical performance and projections for future growth.
2. Drivers: Examination of the key factors propelling market growth.
3. Trends: Identification of emerging trends and patterns shaping the market landscape.
4. Key Segments: Breakdown of the market into its primary segments and their respective performance.
5. Focus Regions and Geographies: Insight into the most critical regions and geographical areas influencing the market.
6. Macro Economic Factors: Assessment of broader economic elements impacting the market.
Semiconductor Capital Equipment Market Overview
Market Drivers –
The rapid rollout of 5G technology is anticipated to spur growth in the semiconductor capital equipment market in the coming years. 5G technology represents the fifth generation of mobile network technology, providing significantly faster data speeds, lower latency, and greater connectivity than previous generations. The demand for 5G technology is escalating due to its capacity to support rapid data speeds and minimal latency, which are essential for emerging applications such as autonomous vehicles, smart cities, and augmented reality. Semiconductor capital equipment is crucial for the implementation of 5G technology, as it facilitates the production of advanced chips and components vital for high-speed data processing and communication infrastructure. For instance, in March 2024, 5G Americas, a US-based industry trade organization, noted that global 5G connections surged to 1.76 billion by the end of 2023, reflecting a 66% year-over-year increase with an additional 700 million connections added. This growth trajectory is expected to accelerate, with forecasts estimating 7.9 billion 5G connections by 2028. Therefore, the rapid deployment of 5G technology will drive the growth of the semiconductor capital equipment market through 2023, into 2024, and is projected to continue expanding by 2028.
Market Trends –
Major companies operating in the semiconductor capital equipment market are focusing on shifting toward heterogeneous chip integration and system-level packaging, such as hybrid bonding, to enhance performance, increase functionality, and meet the growing demand for advanced, high-efficiency semiconductor solutions. Hybrid bonding connects semiconductor chips by creating a direct bond between the chip surfaces, typically involving a metallic and an insulating layer. For instance, in July 2023, Applied Materials, a US-based semiconductor equipment company, unveiled new materials, technologies, and systems designed to support chipmakers in integrating chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs). These innovations enhance Applied’s extensive portfolio of technologies for heterogeneous integration (HI). Heterogeneous integration allows semiconductor manufacturers to combine chiplets of various functions, technology nodes, and sizes into a unified package, enabling them to operate as a single entity. This approach addresses the industry’s challenges, driven by the growing demand for transistors in high-performance computing and artificial intelligence. As traditional 2D scaling of transistors becomes increasingly costly and less effective, HI offers a strategic solution to enhance chip performance, power efficiency, area cost, and time to market (PPACt).
The semiconductor capital equipment market covered in this report is segmented –
1) By Type: Wafer Manufacturing Equipment, Assembly And Packaging Equipment, Test Equipment, Other Types
2) By Application: Wafer Processing, Surface Conditioning, Chemical Mechanical Planarization, Chemical Vapor Deposition, Assembly And Packaging
3) By Industry: Consumer Electronics, Healthcare, Automotive, Information Technology (IT) And Telecommunication, Other Industries
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Regional Insights –
North America was the largest region in the semiconductor capital equipment market in 2023. The regions covered in the semiconductor capital equipment market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
Key Companies –
Major companies in the market are Applied Materials Inc., ASML Holding N.V., Lam Research Corporation, Tokyo Electron Limited, KLA Corporation, United Microelectronics Corporation, Microchip Technology Inc., Semiconductor Manufacturing International Corporation (SMIC, Nikon Corporation, Hitachi High-Technologies Corporation, Advantest Corporation, MKS Instruments Inc., Teradyne Inc., Screen Holdings Co. Ltd., Bruker Corporation, ASM International N.V., DISCO Corporation, Kulicke & Soffa Industries Inc., Edwards Vacuum, Cohu Inc., Veeco Instruments Inc., Rudolph Technologies Inc., Mattson Technology Inc., BE Semiconductor Industries N.V. (BESI), Aixtron SE
Table of Contents
1. Executive Summary
2. Semiconductor Capital Equipment Market Characteristics
3. Semiconductor Capital Equipment Market Trends And Strategies
4. Semiconductor Capital Equipment Market – Macro Economic Scenario
5. Global Semiconductor Capital Equipment Market Size and Growth
…
32. Global Semiconductor Capital Equipment Market Competitive Benchmarking
33. Global Semiconductor Capital Equipment Market Competitive Dashboard
34. Key Mergers And Acquisitions In The Semiconductor Capital Equipment Market
35. Semiconductor Capital Equipment Market Future Outlook and Potential Analysis
36. Appendix
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