The Wafer Processing Equipment Global Market Report 2023 by The Business Research Company, provides wafer processing equipment market overview across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa for the 27 major global industries. The report covers a ten-year historic period – 2010-2021, and a ten-yearforecast period – 2023-2032.
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According to The Business Research Company’s Wafer Processing Equipment Global Market Report 2023, the market size will grow from $138.3 billion in 2022 to $150.46 billion in 2023 at a compound annual growth rate (CAGR) of 8.8%. The Russia-Ukraine war disrupted the chances of global economic recovery from the COVID-19 pandemic, at least in the short term. The war between these two countries has led to economic sanctions on multiple countries, a surge in commodity prices, and supply chain disruptions, causing inflation across goods and services and affecting many markets across the globe. The market size of the global wafer processing equipment is expected to grow to $202.79 billion in 2027 at a CAGR of 7.7%.
Increasing demand for consumer electronic devices is expected to boost the growth of the wafer processing equipment market. An increase in the demand for electronic products has raised customer expectations regarding improved characteristics of new electronic devices. Several consumer electronics and identity solutions including identification tags, smart cards, and more are combined with RFIDs and use wafers for the fabrication of integrated circuits. There is an increasing demand for these ultra-smooth surfaces and thinner wafers by customers for smooth incorporation into electronic devices.
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The wafer processing equipment market is segmented:
1) By Equipment Type: Oxidation Systems, Diffusion Systems, Epitaxial Reactors, Photolithography Equipment, Other Equipment Types
2) By Application: MEMS, RFID, CMOS Image Sensor, Other Applications
3) By End Use: Medical, Military, Solar, Industrial, Other End Uses
Growing demand for miniaturized wafers with the improved performance of devices is a leading trend in the wafer processing equipment market. Semiconductor substrates such as wafers are thinned down to final thicknesses of tens of µm. Most of the semiconductor wafers such as those used in memory, CIS, and power applications are thinned down to 100 µm-200 µm. Further thickness reduction with the necessity to maximize the memory capacity of single packages, improved data transfer rates, and power consumption mostly fuelled by mobile applications is required in the case of memory devices. Standard memory devices such as 2D NAND/DRAM use silicon wafers that are thicker than 200 µm. By 2025, 3D stacked DRAM thickness is expected to keep reducing from 50 µm – 30 µm thick silicon substrates. Currently, BSI CIS wafers are the thinnest wafers across all applications with a thickness below 10 µm. Thus, ultra-smooth surfaces and thinner wafers for incorporation into the devices are continuously gaining popularity in recent years.
The wafer processing equipment market report table of contents includes:
1. Executive Summary
2. Wafer Processing Equipment Market Characteristics
3. Wafer Processing Equipment Market Trends And Strategies
4. Wafer Processing Equipment Market – Macro Economic Scenario
5. COVID-19 Impact On Wafer Processing Equipment Market
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26. Africa Wafer Processing Equipment Market
27. Wafer Processing Equipment Market Competitive Landscape And Company Profiles
28. Key Mergers And Acquisitions In The Wafer Processing Equipment Market
29. Wafer Processing Equipment Market Future Outlook and Potential Analysis
30. Appendix
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