Wafer level packaging market will expect to grow at a rate of 21.0% for the forecast period of 2021 to 2028. Wafer level packaging market report analyses the growth, which is currently being growing due to the impending need for circuit miniaturization in microelectronic devices.
Global Wafer Level Packaging Market Definition
Wafer-level packaging (WLP) is a technology used for interconnecting electronic components, such as resistors, capacitors, transistors, and others onto a single chip to make an integrated circuit while utilizing deposited solder bumps onto the chip pads. It enables integration of wafer fab, test, packaging, and burn-in at the wafer level to simplify the manufacturing procedure.
Advantages of WLP are multichip capability, increased I/O density, reduced form factor, improved electrical & mechanical performance, and outstanding cost/performance capability. Based on the product, the market is classified into 3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and Others ( 2D TSV WLP and Compliant WLP). Based on the application, the market is bifurcated into Electronics, IT & Telecommunication, Industrial, Automotive, Aerospace & Defense, Healthcare, and Others (Media & Entertainment and Non-Conventional Energy Resources).
In the semiconductor industry, a packaging device used to package integrated circuits (ICs) is called the wafer level package (WLP). Wafer level packaging (WLP) is a chip-scale package (CSP) technology that allows wafer fab, test, packaging, and burn-in to be incorporated at the wafer level to simplify the production process.
The growing number of technological superiority over traditional packaging change in infrastructure of the electronics industry and the expanding demand for the portable consumer electronic devices, rising demand for longer battery life and smaller designs in smart phones, growing requirement for circuit miniaturization in microelectronic devices, rising demand for low cost, small sizes, and high performance of packaging solutions are some of the major as well as vital factors which will likely to augment the growth of the wafer level packaging market in the projected timeframe of 2021-2028. On the other hand, rising adoption of along with increasing trend in the usage of ultra-thin android cell phones in both developed and developing countries which will further contribute by generating massive opportunities that will lead to the growth of the wafer level packaging market in the above mentioned projected timeframe.
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Global Wafer Level Packaging Market: Major Players
Qualcomm Technologies, Inc.
Fujitsu
Deca Technologies
Applied Materials, Inc.
ASML Holding N.V
Lam Research Corporation
Toshiba Corporation
Amkor Technology, Inc.
Jiangsu Changjiang Electronics Technology Co. Ltd.
Tokyo Electron Ltd.
Global Wafer Level Packaging Market: Types
Fan-in WLP
Fan-out WLP
Global Wafer Level Packaging Market: Applications
Electronics
IT & Telecommunication
Industrial
Automotive
Global Wafer Level Packaging Market: Regional Analysis
All the regional segmentation has been studied based on recent and future trends, and the market is forecasted throughout the prediction period. The countries covered in the regional analysis of the Global Wafer Level Packaging market report are U.S., Canada, and Mexico in North America, Germany, France, U.K., Russia, Italy, Spain, Turkey, Netherlands, Switzerland, Belgium, and Rest of Europe in Europe, Singapore, Malaysia, Australia, Thailand, Indonesia, Philippines, China, Japan, India, South Korea, Rest of Asia-Pacific (APAC) in the Asia-Pacific (APAC), Saudi Arabia, U.A.E, South Africa, Egypt, Israel, Rest of Middle East and Africa (MEA) as a part of Middle East and Africa (MEA), and Argentina, Brazil, and Rest of South America as part of South America.
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